PCB Technology
Advanced constructions, mastered.
Sunrise invests in the equipment and process know-how to manufacture the technologies pushing modern electronics forward — without sacrificing the speed you expect from us.
HDI PCBs
High-Density Interconnect boards with stacked and staggered microvias, fine lines and advanced multilayer configurations. Used in aerospace communication, advanced radar, instrumentation and modern commercial electronics where space is limited.
Learn more
Flex PCBs
Flexible circuits engineered for movement, bending and unique form factors. Used in aerospace harnesses, antennas, wearables and compact devices that must withstand repeated motion, temperature swings and vibration.
Learn more
Rigid-Flex PCBs
Hybrid boards combining rigid sections with flexible attachments. Reduce connectors, save weight and improve reliability — frequently chosen for avionics, GPS, military comms and compact commercial devices.
Learn more
RF & Microwave
Rogers, Taconic and PTFE-based laminates engineered for controlled impedance and stable performance across high frequencies. For defense radar, satellite, 5G and commercial wireless.
Learn more
Heavy Copper PCBs
Thick copper layers (2 oz to 10 oz+) for high current, high power and extreme thermal or mechanical stress — power electronics, motor controls, industrial and aerospace power distribution.
Learn moreMetal Core (MCPCB)
Aluminum or copper-core PCBs with thermally conductive dielectric. Superior heat management for LED lighting, power supplies and aerospace components running hard.
Learn moreHigh-Speed PCBs
Engineered for high-frequency, high-data-rate signals with minimal degradation. Tight impedance control, low-loss laminates, careful stackup design and via management for DDR, PCIe, 25G/56G/112G channels.
Learn moreAI Accelerator Boards
High-performance PCBs supporting GPU, TPU, NPU, FPGA and ASIC accelerators for AI training and inference — ultra-low-loss laminates, advanced HDI, copper-filled VIPPO and tight power integrity.
Learn more
Rigid & Multilayer
Up to 50-layer rigid constructions with sequential lamination, tight registration and controlled impedance. Backplanes for telecom, networking and high-end industrial systems.
Learn moreEngineering Knowledge Library
The technical references our customers ask for.
Deep dives into the topics that drive PCB performance — from stackup and impedance to via fill and surface finish selection. Written by our engineers, for yours.
PCB Stackups
Signal integrity, power integrity and EMI control through proper layer arrangement.
Read articleControlled Impedance
Targets, tolerances, modeling and TDR verification for high-speed signals.
Read articleBlind & Buried Vias
Layer-selective interconnects for HDI, fine-pitch BGA and stub-free signals.
Read articleVia Fill Options
Tenting, plugging, copper fill and VIPPO for fine-pitch and thermal designs.
Read articleSurface Finishes
ENIG, ENEPIG, HASL, OSP, hard gold — selecting for solderability and wear.
Read articleSolder Mask
LPI mask, design rules, mask dams, via tenting and color choice.
Read articleHigh-Speed PCBs
Multi-gigabit boards: low-loss laminates, impedance, EMI and SI testing.
Read articleAI Accelerator PCBs
GPU/TPU/ASIC platforms — bandwidth, power integrity and HDI strategy.
Read articleHDI Construction
Microvias, via-in-pad fill options and 1+N+1 / 2+N+2 / any-layer builds.
Read articleFlex PCBs
Static vs dynamic flex, RA copper, IPC-6013 Type 1–4 and bend radius.
Read articleRigid-Flex PCBs
Integrated rigid + polyimide flex constructions for 3-D, high-reliability designs.
Read articleHeavy Copper PCBs
3 oz to 10 oz+ copper for high current, thermal and mechanical demands.
Read articlePolyimide Material
High-Tg, high-reliability laminates for harsh thermal environments.
Read articleRigid PCBs
Multilayer rigid construction, stackup engineering, vias, copper weights and IPC standards.
Read articleMaterial Characteristics
Dk, Df, Tg, Td, CTE and the rest of the laminate datasheet — what each property means.
Read articleMaterial Family Comparison
FR-4 vs high-speed vs RF vs polyimide vs metal core — picking the right starting point.
Read articleOur Process
Six steps. Zero surprises.
Design Review (DFM)
Free design-for-manufacturability review before production. We catch issues early.
Material Selection
Engineering support to pick the right laminate, copper weight and finish for your application.
Tooling & Imaging
LDI direct imaging for fine features and precise registration on high-layer-count boards.
Drilling & Plating
Mechanical and laser drilling, with controlled-depth and back-drilling capability.
Lamination & Etch
Sequential lamination for HDI builds. Tight impedance control through fine-line etching.
Test & Inspection
100% electrical test, AOI, X-ray for BGAs, and IPC-A-600 visual inspection on every board.