| Category | Attribute | Current | Near Term | Long Term |
|---|---|---|---|---|
|
Fine Line/Space |
Inner Layers (Line/Space) Outer Layers (Line/Space) |
3/3 mil 3/4 mil |
2.5/2.5 mil 3/3 mil |
2/2 mil 2.5/2.5 mil |
|
Buried Core Holes |
Mechanical (Drilled Hole/Land) Laser Drill (Drilled Hole/Land) |
5.9/12 mil N/A |
4/10 mil 4/13 mil |
2.5/2.5 mil 3.5/8 mil |
|
Special Processing |
Controlled Depth Drilling - Blind Vias Sequential Lamination - Buried Vias Via in Pad Technology - Silver Epoxy Via in Pad Technology - Non Conductive Epoxy Edge Plating |
Yes Yes Yes Yes Yes |
Yes Yes Yes Yes Yes |
Yes Yes Yes Yes Yes |
|
Materials |
High TD - RoHS Halogen Free High Performance Polyimide - High Temp Teflon High Speed RF Signals |
Yes Yes Dk-3.0 Df<0.005 Yes Yes Yes |
Yes Yes Dk<3.0 Df<0.005 Yes Yes Yes |
Yes Yes Dk<3.0 Df<0.002 Yes Yes Yes |
|
Through Via Holes |
Drilled Hole/Land Registration to Internal Land Maximum Copper Plating Aspect Ratio |
5.9/12 mil +/-5.0 mil 15:1.0 |
4/10 mil +/-4.5 mil 18:1.0 |
3.5/8 mil +/-4.0 mil 20:1.0 |
|
Panel / Board |
Maximum Layer Count Maximum Thickness Maximum Process Panel Size |
50 layer 0.40 24" x 30" |
60 layer 0.40 24" x 30" |
60+ layer 0.40 24" x 30" |
|
Impedance |
Single ended & Differential Pair Tolerance |
+/- 5% |
+/- 5% |
+/- 5% |
|
Imbedded Passives |
Resistors Capacitance/Capacitors |
N/A 2.0 mil Core |
+/- 15% 1.0 mil Core |
+/- 10% Thin Film |
|
Surface Finish |
SMOBC HASL Lead Free HASL Electrolytic Hard Gold Electrolytic Soft Gold Palladium Nickel Carbon Ink Electroless Ni/Au Immersion Silver Immersion Tin Organic Surface Protection (Entek) |
Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes |
Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes |
Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes |
|
Quality Standards |
ISO 9001/2000 IPC 6012 Class 1,2,3 TL 9000 Mil-PRF-31032 |
Yes Yes No No |
Yes Yes Yes No |
Yes Yes Yes Yes |
Sr. Product Engineer
Jigar Patel | JPatel@sunrisepcb.com
847-357-0500