CAPABILITIES

• Quick Turn Protos & Production
• Prototype as quick as 12 hours
• Shortest Standard lead times
• High Volume Production/
• Supply chain Management
• 2 To 44 Layer Multilayers
• 15:1 Drill Aspect Ratio
• Maximum Panel Size - 24" x 30"
• BBV's & Micro Vias
• Via In Pad with Fill Options (Conductive, Non Conductive, Copper Plug)

SURFACE FINISH OPTIONS

• ENIG
• HASL
• OSP
• Hard & Soft Gold
• Immersion Silver
• Selective Finishes
• D I G

BASE MATERIALS

• ROHS Compliant Options
• High Speed Digital Options
• High Frequency RF Options
• High Temperature Options
• Isola IS 410 & FR370 HR
• Nelco 4000-13
• Ventec VT 46 (High Speed Low Loss)
• Ventec VT 47
• ITEQ IT 180
• Rogers 3010, 4000, 5880
• Polyimide & GETEK
• Ventec VT 90 (Polyimide)

PRODUCTS

• Rigid
• Flex
• Rigid-Flex
• Hybrid RF/Digital
• Prototype Quick Turn
• Production Quick Turn
• Metal Core
• Aluminum Backed
• Cavity Boards
• Embedded Passives

SPECS AND
TOLERANCES

• Concurrent Engineering Solutions
• Quick Quote Response
• DFM Review & Anaysis
• Value-Added Engineering Solutions
• Responsive Service Solutions
• Regional Field & FAE Support
• Main Phone - 847-357-0500

CUSTOMER SERVICE

• Outerlayer Trace / Space -- .003" / .004"
• Innerlayer Trace / Space -- .003" / .003"
• Minimum Drilled Hole -- .0059"
• Standard Drilled Hole -- .010"
• Drill Aspect Ratio -- 15 To 1
• Minimum Pad Size -- .008"
• Minimum Feature to Edge -- .010"
• Minimum Core Thickness -- .002"
• Controlled Impedance Tolerance -- 5%
• Controlled Depth Drilling -- YES
• Sequential Lamination -- YES